Power, performance, and area metrics alone are no longer sufficient to capture the full range of design goals.

MANASSAS, Va., Nov. 19, 2025 /PRNewswire/ -- BAE Systems (LON: BA) has added new capabilities to its next-generation, radiation-hardened 12 nanometer (nm) Storefront. The RH12™ Storefront is an ...

Researchers from RIKEN created a self-healing polymer that can repair itself after being damaged by modifying polyolefins, a ...

Historically, terahertz frequencies have been the least utilized portion of the electromagnetic spectrum. People have ...

CDimension develops atom-thin 2D materials that make chips faster, more efficient, and ready for AI and quantum computing.

Next-generation chips offer opportunities in AI advancements, premium consumer electronics, data centers, and 5G networks. Challenges exist in breaking the 2-nm barrier, with ongoing EUV dominance and ...

Nvidia's advantage is that it is much more than a hardware company. Almost all early AI code was written on its CUDA software ...

The article explains the unique SI and PI challenges in 3D IC designs by contrasting them with traditional SoCs.

A broad association of researchers from across Lawrence Berkeley National Laboratory (Berkeley Lab) and the University of ...

Yield, I/O and other implementation details may stymie the emergence of an open chiplet market. By Chris Edwards ...

Researchers from McMaster University and the University of Pittsburgh have created the first functionally complete logic gate ...

At the 2025 NYU Brooklyn 6G Summit, we chatted with Peter Vetter, Nokia Bell Labs President of Core Research about the ...